晶片端面檢查機 End faces Chip inspection machine

♦ 機型：HJ-CPAC-200 ( Model No.:HJ-CPAC-200 )

ㄧ、機台說明  Product Description 

此機台是晶片外觀瑕疵檢測設備，自動檢查晶片端面功能區瑕疵問題。晶片入 / 出料方式可依使用者需求搭配選擇 Ring / gel-pak / wafer-pak，AOI自動追焦系統，可避免景深造成誤判。

This machine is a end faces Chip inspection device that automatically checks the Chip's end faces.Chip feeding and discharging methods can be selected according to the user Ring/gel-pak/wafer-pak.AOI automatic tracking system can avoid false positives caused by depth of field.

二、產品特性 Product Features

■ 塑料吸嘴，避免吸取時損傷晶片。

■The plastic nozzles avoid damage to the chip during drawing.

■ 吸嘴彈力均 <20g。

■ The nozzle elasticity <20 g.

■ 線性馬達位移控制，超靜音，搭配光學尺精準度高。

■The linear motor displacement control is very quiet and the optical ruler has high precision.

■ 旋轉檢測功能，可進行晶片多面檢測。

■ The device's rotation detection function enables wafer multi-face inspection.

■ Filp 自動翻轉功能，可依需求開啟。

■The device auto flip function can be turned on according to user requirements.

■ 晶片入 / 出料方式可依使用者需求搭配選擇 Ring / gel-pak / wafer-pak。

■The Chip feeding and discharging method can be selected according to the user's Ring/gel-pak/wafer-pak.

■ 高畫素相機搭配 AOI 自動追焦系統，可避免景深造成誤判。

■The high-resolution camera with AOI automatic tracking system can avoid false positives caused by depth of field.

■ 檢查項目：水波紋 / 鍍膜脫落 / 空洞 / Particles / Contamination/Broken。

■Inspection item: water ripple / coating peeling / cavity /Particles/Contamination/Broken.

■ 200x~500x 放大倍率；清楚檢測所有瑕疵。

■200x~500x magnification for clear detection of all defects.

■ 標配 HEPA 過濾 & 靜電風扇。

■The device has HEPA filters and an electrostatic fan.

■ 全機 IPC 控制，操作介面清楚直覺。

■Full IPC control, the operation interface is clear and intuitive.

三、產品規格 Product Specifications