♦ 機型：HJ-LPAP-200 ( Model No.：HJ-LPAP-200)
ㄧ、機台說明 Machine Description
泓傑科技針對SMD支架所開發的全自動雷射打印機;可精準定位,快速位移,軌道寬度可依客戶材料調整(Max 60mm),有效節省改機成本,並搭配集塵設備,防止粉塵污染。
Designed to work with SMD materials, the functions of this fully Auto Laser Marking Machine developed by HON-JER Technology co., Ltd are locates accurate, fast displacement, the track width can be resized (Max70mm) and changes machine the cost economical effectively, and matches the collection dust equipment, prevents the dust pollution.
二、產品特性Product Features
■ 本產品可由支架堆疊入料,料盒收料。
This product may pile up one on top of another into the material by the support, material sorting containers.
■ 軌道寬度可調整,共用性高。
The orbital width may adjust, reusable is high.
■ CCD外觀監控,可由外部監控打印狀況。
The CCD outward appearance monitoring, may by exterior monitor the printing condition.
■ 集塵設備,防止粉塵污染。
The collection dust equipment, prevents the dust pollution.
■ 搭配伺服馬達控制,精準度高。
Server-controlled motors improve accuracy is high.
■ 雷射機螺桿升降機構,方便調整。
The laser machine screw rod elevating mechanism, facilitates the adjustment.
■ 彩色人機觸控介面,方便操作。
Man Machine Interface, convenience operation.
三、產品規格 Product Specifications
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機台產能 Machine capacity |
10K；依打印範圍數量而定Decides according to the print span quantity. |
|
電源規格 Power Specifications |
單相Single-phase AC220V,15A |
|
氣壓規格 Pressure Specifications |
4~6kg/cm2 |
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機台尺寸 Machine Size |
寬W115*深D155*高H160 cm |